Hemeixin Electronics Co, Ltd.

Hemeixin Electronics Co., Ltd. is a leading quick-turn manufacturer specializing in prototype, low-volume, and high-mix printed circuit boards (PCBs), offering personalized one-stop solutions for fabrication and assembly to meet diverse electronic needs. The company excels in advanced PCB technologies, including laser-drilled microvias, blind/buried vias, heavy copper up to 30 oz., via-in-pad designs, and impedance-controlled boards up to 58 layers, utilizing materials like polyimide, low-loss laminates (e.g., I-Speed, FR408HR), high-speed digital (e.g., Megtron6), and RF/microwave substrates (e.g., RO4350B, Taconic TLY). Its automation focus integrates state-of-the-art production lines with 42 manufacturing stations for rapid prototyping and turnkey services, achieving turnaround times as fast as 72 hours or 5 days for full assembly, ensuring high reliability and on-time delivery. Industries served include portable communications, networking equipment, medical devices, aerospace, and high-reliability applications. Notable achievements encompass a 687-strong workforce with 87 engineers, ISO 9001 certification for quality management, UL and RoHS approvals, and a global customer base spanning Southeast Asia, Europe, and America through efficient SMT and mixed-technology assembly. Hemeixin drives innovation in HDI any-layer boards and RF solutions, supporting clients in optimizing electronic designs for performance and sustainability.