Etron Technology to Unveil "MemorAiLink Show Up" Edge AI Innovations at CES 2026

Etron Technology will showcase its latest innovations at CES 2026 (January 6-9) under the core theme ‘MemorAiLink® Show Up’. The presentation will highlight comprehensive edge AI solutions across four strategic domains: memory, intelligent vision sensing, high-speed connectivity, and privacy computing. These innovations are designed to boost system performance and reduce design complexity while accelerating the deployment of smart automation—a critical factor in the rapidly expanding global edge AI and robotics market.

Award-Winning AI Vision and Memory Platforms

Etron will debut its ‘RPC® inside G120 Subsystem’, a winner of the 2025 Hsinchu Science Park Innovative Product Award. This award underscores Etron's technological leadership in intelligent vision sensing and semiconductor integration. The company is also expanding MemorAiLink®, its one-stop AI memory development platform, which offers a full spectrum of services including:

• Customized and AI-dedicated memory solutions.
• Heterogeneous integration and advanced packaging.
• Scalable DDR3 product lines.
• ASIC AI memory designed to support SLM/VLM computing for edge AI applications.

High-Speed Connectivity and USB PD 3.2 Certification

In the high-speed connectivity arena, Etron's EJ732 series has achieved USB-IF certification as a USB PD 3.2 DRP controller. This industry-first three-in-one platform covers host, device, and cable integration. The EJ732 supports up to 240W (48V/5A) Extended Power Range (EPR) and enables USB4 80Gbps data transfer. This breakthrough allows developers to build secure, high-performance, and fully compatible USB-C solutions at an unprecedented pace.

Robotics Barebone Platforms and Strategic Ecosystems

With the global robotics market projected to exceed $100 billion, Etron and its subsidiary, eYs3D Microelectronics, have unveiled the ‘AMR01C/AMR01M Robotics Barebone Platforms’. These platforms utilize an all-in-one design that integrates:

• Chassis and drivetrain systems.
• Sensors and controllers.
• Navigation and obstacle avoidance algorithms.

Strategic partnerships, such as the collaboration between eYs3D/Etron and Asia Optical, are building domestic robotic base platforms. This initiative is a vital step in constructing a robotics ecosystem that leverages local chips to provide cost competitiveness and a foundation for Physical AI and generative AI.

XINK Nano: Real-Time Edge Computing for Smart Cities

The XINK Nano platform is engineered for real-time edge computing and sensor fusion. It has already been successfully deployed by a leading domestic EV charging system integrator for smart parking applications.

Equipped with a high-performance Neural Processing Unit (NPU), XINK Nano fuses RGB and Time-of-Flight (ToF) dual-sensor data. Unlike traditional cloud architectures, this platform enables local on-device processing. This edge-centric approach significantly reduces data transmission latency and operational costs while enhancing system stability for local sensing.