Integrated with eYs3D's Proprietary XINK-ll Edge Spatial Computing Platform and the Sense and React HMI Development Interface for robust support in next-generation AI applications.

Las Vegas and Taipei, January 2025 – With the rapid rise of AI image sensing and edge computing technologies, the market for robots and intelligent unmanned vehicles is experiencing explosive growth. Etron Technology (TPEx: 5351.TW) subsidiary eYs3D Microelectronics has launched the new eSP936 multi-sensor image controller IC. The eSP936 supports the synchronous processing of data from up to seven visual sensors, providing high image recognition accuracy. Paired with the Sense and React™ human-machine interaction developer interface, it enables intelligent control through human-machine interaction, becoming a key driver for the implementation of smart applications.

The eSP936 can be integrated with multi-modal visual language models (VLM), combining multiple visual sensors with real-time AI edge computing capabilities. It is suitable for smart application scenarios such as unmanned vehicles like automated guided vehicles, autonomous mobile robots, and drones. The eSP936 can process multiple 2D images at high speeds and generate 3D depth maps, enhancing precise environmental recognition. Embedded AI chips further enable dynamic navigation in complex environments. Additionally, industrial and service robots can achieve more precise intelligent perception in complex scenarios, combining real-time computing and automated operations for high-efficiency performance. In immersive human-machine interaction systems, the eSP936 can be integrated with AI SoC platforms to enhance the Sense and React interaction experience, widely applicable in Drones, USV (Unmanned Surface Vehicle), video conferencing, augmented education, and extended reality (XR) fields.

Key technology highlights of the eSP936: support for synchronized processing of data from up to seven visual sensors, built-in DRAM chip, and wide-angle image de-warping technology, enabling high-precision environmental perception and multi-view 3D depth map generation. It also features high-performance data compression capabilities to reduce latency, providing developers with a flexible and efficient platform. The MIPI+USB simultaneous processing technology ensures high-quality 2D image and 3D depth map output, improving image recognition accuracy. We hope to create more opportunities for applications where customers can leverage the single-chip eSP936 IC to maximize the potential of the AI Agency! 

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