Teledyne DALSA Launches Xtium™3 PCIe Gen4 Frame Grabber for Ultra-Fast Industrial Imaging
Teledyne DALSA has introduced the Xtium™3 PCIe Gen4 frame grabber, a next-generation imaging solution engineered for ultra-fast data throughput and high-performance industrial applications. Designed for maximum sustained bandwidth and real-time image processing, the Xtium3 series sets a new benchmark for machine vision systems with advanced CLHS support, long-distance data transmission, and seamless integration with Sapera™ LT SDKs.
Engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications
Teledyne DALSA, a Teledyne Technologies company, has announced the immediate release of the Xtium™3 PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications.
Building on the proven Xtium2 platform, the first model, Xtium3-CLHS PX8, supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution accommodates up to seven CLHS lanes, each operating at 10.3125 Gbps (72.2 Gbps in total), enabling acquisition bandwidths of 8.6 GB/s and host transfer rates of up to 13.2 GB/s via a PCIe Gen4 x8 slot.
Key Features and Performance Benefits:
Optimized Performance & Sustained Throughput: The PCIe Gen4 architecture delivers a sustained throughput of 13.2 GB/s directly to host memory, significantly reducing CPU load and accelerating image processing for demanding industrial applications.
High-Speed Data Transmission: Utilises CLHS X-protocol with over 97% packet efficiency and 64/66-bit encoding. The system supports long cable lengths, exceeding 30 metres using 7-lane AOC cables, enhancing installation flexibility.
Real-time Data Forwarding: The frame grabber enables redistribution of incoming data to up to 12 computers via standard AOC cables, supporting complex distributed image processing workflows.
Broad Camera Compatibility: The Xtium™3 series supports area and line scan, monochrome, and color cameras, delivering exceptional performance for Camera Link HS systems (with a future model planned for CoaXPress®).
Advanced Imaging Integration: The platform enables multi-plane HDR processing, specifically optimized for Teledyne’s Linea™ HS2 16K camera, delivering advanced ready-to-use image data.
Software Support: The new series is fully compatible with Teledyne’s Sapera™ LT Software SDKs and third-party software, ensuring seamless integration and development.
The Xtium3 series is designed to meet the demands of modern machine vision systems, offering robust performance, scalability, and flexibility.
Fully supported by Teledyne’s Sapera LT Software SDKs, the Xtium™3 PCIe Gen4 empowers developers and integrators to build robust, high-speed imaging systems with minimal overhead and maximum flexibility, extending the capability of the Xtium2 platform.
