Micron delivers most compact UFS package to enable next-gen phone designs and larger batteries
Published on : Thursday 29-02-2024
Company extends UFS 4.0 mobile storage leadership with proprietary firmware features to accelerate data-rich experiences.
Barcelona, February 28, 2024 – Mobile World Congress – Micron Technology, Inc., has announced that it is delivering qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution with breakthrough proprietary firmware features delivered in the world’s most compact UFS package at 9x13 mm. Built on its advanced 232-layer 3D NAND and offering up to 1 terabyte (TB) capacity, the UFS 4.0 solution provides best-in-class performance and end-to-end innovation, enabling faster and more responsive experiences on flagship smartphones.
Micron UFS 4.0 accelerates data-intensive experiences with up to 4300 megabytes per second (MBps) sequential read and 4000 MBps sequential write speed, twice the performance of previous generations. With these speeds, users will be able to launch their favorite productivity, creativity, and emerging AI apps more quickly. Large language models in generative AI applications can be loaded 40% faster, resulting in a smoother experience when initialising conversations with AI digital companions.
“Micron’s latest UFS 4.0 solution enables world-class storage performance and reduced power in the world’s smallest UFS package,” said Mark Montierth, general manager and corporate vice president of Micron’s Mobile Business Unit. “Supercharged with breakthrough firmware advancements to keep smartphones running like new, Micron UFS 4.0 raises the bar for mobile storage with enhanced performance, flexibility and scalability to accelerate the rollout of generative AI-capable smartphones.”
Compact package design lays the foundation for energy-efficient, ultra-slim smartphones Since introducing its UFS4.0 solution last June with an 11x13 mm package, Micron has reduced the footprint for its UFS 4.0 solution to offer the world’s most compact managed NAND package size at 9x13 mm. These significant space savings result in an optimal size for next-generation foldable and ultra-slim smartphone designs and free more real estate for manufacturers to provide a larger battery. In tandem with the solution’s 25% increase in power efficiency, these benefits enable extended battery life for users, even when running power-draining features such as AI, augmented reality, gaming and multimedia apps.
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